Capacity
3 Monthly output:
 
Single-sided Boards:
   150,000 sq.ft
 
Non-PTH Double-sided Boards:
   100,000 sq.ft
 
PTH Double-sided boards:
  100,000 sq.ft
 
Multi-layer Boards:
  80,000 sq.ft
 
2 Plant Area: 200,000 sq. ft
1 Man Power: 1000

 

 

 

 

 

Specification
Layers:
1 to 18 Layers
Base Materials:
 CEM1, FR4,  High TG FR4
Base Copper Thickness:
 1OZ oz. to 3 oz.
BoardThickness:
 0.4mm-4.0mm
Maximum Panel Size:
 2100mm x 600mm
Minimum Hole Diameter:
 0.2mm
PTH Hole Tolerance:
 0.05mm
Aspect Ratio:
 8:1
Blind or Buried Via:
 no
Minimum Line Width:
 0.1mm
Minimum Line Spacing:
 0.1mm
Minimum Bonding Pitch:
 0.127mm
Minimum SMT Pitch:
 0.40mm " (center to center)
Mechanical Fabrication:
 Mini Hole registration tolerance (NPTH): +/-0.076
Mini Hole registration tolerance (PTH): +/-0.076mm
Mini Pattern registration tolerance: +/-0.076mm
Mini S/M registration tolerance (LPI): +/-0.076mm
Mini Annular ring: +/-0.1mm( artwork)
Mini S/M bridge (LPI): 0.1mm
Plated gold thickness: 0.01um – 0.025um
Immersion gold thickness: 0.025um -- 0.1um
Electrical Testing:
 Voltage: 50V - 240V
ontinuity:5 - 100Ohms
Twist and Warp: Less than 1%